GPU SYSTEMS

Key Features/Applications:

2D/3D and CAD Applications, Big Data Analytics, Edge Computing, VDI, Cloud Computing, Virtualization

CPU:

Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors

Chassis:

2U / 1 Node

Drive:

8x Hot-swap 2.5" SAS/SATA drive bays, 2x Hot-swap 2.5" SATA/NVMe drive bays

RAM:

16x DDR4 DIMM Slots

Network Ports:

1x SIOM for flexible Networking

Key Features/Applications:

AI/ML, Deep Learning Training and Inference, Big Data Analytics, High Performance Computing (HPC, Research Laboratory/National Laboratory

CPU:

Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors

Chassis:

4U / 1 Node

Drive:

24x Hot-swap 3.5" drive bays

RAM:

24x DDR4 DIMM Slots

Network Ports:

2x 10GBase-T LAN ports

Key Features/Applications:

Network Security Appliance, SD-WAN, vCPE controller box, IoT Edge Computing

CPU:

Dual 2nd Gen Intel® Xeon® Scalable processors, up to 28 Cores, up to 56 Threads, 70-205W

Chassis:

4U Rackmountable / Tower Optional Rackmount Kit

Drive:

8 Hot-swap 3.5" drive bays

RAM:

16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM

Network Ports:

2x 10GBase-T LAN ports, Supports 10GBASE-T, 100BASE-TX, and 1000BASE-T; 1 dedicated LAN for IPMI 2.0

Key Features/Applications:

AI/ML, Deep Learning Training and Inference, High Performance Computing (HPC), Big Data Analytics, Astrophysics Simulation, Chemistry Simulation, Research Laboratory/National Laboratory

CPU:

Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)

Chassis:

4U Rackmountable

Drive:

Up to 24 Hot-swap 2.5" drive bays; 8x 2.5" SATA drives supported with included H/W, 2x 2.5" NVMe drives supported with included H/W, 1 NVMe based M.2 SSD

RAM:

24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM

Network Ports:

2x 10GBase-T LAN ports via Intel C622

Key Features/Applications:

AI/ML, Deep Learning Training and Inference, High Performance Computing (HPC), Big Data Analytics, Astrophysics Simulation, Chemistry Simulation, Research Laboratory/National Laboratory

CPU:

Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)

Chassis:

4U Rackmountable

Drive:

Up to 24 Hot-swap 2.5" drive bays 8x 2.5" SATA drives supported with included H/W, 2x 2.5" NVMe drives supported with included H/W

RAM:

24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM

Network Ports:

2x 10GBase-T LAN ports via Intel C622

Key Features/Applications:

Powerful performance, Scale-up storage and expansion design, Flexible networking module design, IoT Edge Computing, Advanced air cooling solution, Enhanced IT-infrastructure management, Ready for AI and HPC workloads

CPU:

Dual Socket 4th Generation Intel® Xeon® Processor Scalable Family

Chassis:

1U

Drive:

12x2.5” NVMe/SATA/SAS* hot-swap bay

RAM:

32 x DDR5 4800(1DPC)/4400(2DPC)

Network Ports:

4 x1Gbe(Intel I350-AM4) RJ45 port or 2 x 10Gbe(Intel X710-AT2) RJ45 port

Key Features/Applications:

High Performance Computing, AI/Deep Learning TrainingIndustrial Automation, Retail, Climate and Weather Modeling

CPU:

Dual Socket SP5, AMD EPYC™ 9004 Series Processors

Chassis:

8U Rackmount

Drive:

1 M.2 NVMe for boot drive only, 2x 2.5" Hot-swap SATA drive bays, up to 16x 2.5" Hot-swap NVMe drive bays (12 by default + 4 optional)

RAM:

Slot Count: 24 DIMM slots, Max Memory (2DPC): Up to 6TB 4800MT/s ECC DDR5 RDIMM/LRDIMM

Network Ports:

Flexible Networking

Key Features/Applications:

Artificial Intelligence (AI), Large Language Model (LLM), Cloud Solution Provider (CSP), High Performance Comptue (HPC), Research Lab

CPU:

Quad AMD® EPYC™ MI300A processors

Chassis:

2U Rackmount

Drive:

Default 8x 2.5" Hot-swap NVMe or Optional 8x 2.5" SAS3/SATA3 via storage add-on card; 2x internal M.2 NVMe/SATA

RAM:

Slot Count: Onboard Memory, Max Memory: Up to 512GB ECC HBM3

Network Ports:

Flexible networking options with 2 AIOM networking slot (OCP NIC 3.0 compatible)

Key Features/Applications:

Artificial Intelligence (AI), Large Language Model (LLM), Cloud Solution Provider (CSP), High Performance Comptue (HPC), Research Lab

CPU:

Quad AMD® EPYC™ MI300A processors

Chassis:

4U Rackmount

Drive:

Default 8x 2.5" Hot-swap NVMe or Optional 24x 2.5" SAS3/SATA3 via storage add-on card; 2x internal M.2 NVMe/SATA;

RAM:

Slot Count: Onboard Memory, Max Memory: Up to 512GB non-ECC HBM3

Network Ports:

Flexible networking options with 2 AIOM networking slot (OCP NIC 3.0 compatible)

Key Features/Applications:

High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Climate and Weather Modeling

CPU:

Dual AMD EPYC™ 9004 Series Processors

Chassis:

8U

Drive:

1 M.2 NVMe for boot drive only, 2x 2.5" Hot-swap SATA drive bays, up to 16x 2.5" Hot-swap NVMe drive bays (12 by default + 4 optional)

RAM:

24 DIMM Slots; Up to 6TB DRAM; 4800 ECC DDR5 LRDIMM;RDIMM

Network Ports:

Flexible