LIQUID COOLING SERVERS

Key Features/Applications:

High Performance Computing, AI/Deep Learning Training and Inference, Large Language Model (LLM) and Generative AI

CPU:

NVIDIA 72-core NVIDIA Grace CPU on GH200 Grace Hopper™ Superchip

Chassis:

1U Rackmount Liquid Cooling

Drive:

4 front hot-swap E1.S NVMe drive bay(s)

RAM:

Slot Count: Onboard Memory, Max Memory: Up to 480GB ECC LPDDR5X, Additional GPU Memory: Up to 96GB ECC HBM3

Network Ports:

1 RJ45 1 GbE Dedicated IPMI LAN port(s)

Key Features/Applications:

High Performance Computing, AI/Deep Learning Training and Inference, Large Language Model (LLM) and Generative AI

CPU:

NVIDIA 72-core NVIDIA Grace CPU on GH200 Grace Hopper™ Superchip

Chassis:

1U Rackmount Liquid Cooling

Drive:

8 front hot-swap E1.S NVMe drive bay(s)

RAM:

Slot Count: Onboard Memory, Max Memory: Up to 480GB ECC LPDDR5X, Additional GPU Memory: Up to 96GB ECC HBM3

Network Ports:

1 RJ45 1 GbE Dedicated IPMI LAN port(s)

Key Features/Applications:

High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Healthcare, Conversational AIBusiness Intelligence & AnalyticsDrug Discovery, Climate and Weather Modeling, Finance & Economics

CPU:

Dual 5th/4th Gen Intel® Xeon® Scalable processor support

Chassis:

2U Rackmount Liquid Cooling

Drive:

2 M.2 NVMe for boot drive only, 4x 2.5" Hot-swap NVMe/SATA3 drive bays

RAM:

32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 5600MTs ECC DDR5

Network Ports:

Flexible networking options

Key Features/Applications:

High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Healthcare, Conversational AIBusiness Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics

CPU:

5th/4th Gen Intel® Xeon® Scalable processor support

Chassis:

4U Rackmount Liquid Cooling

Drive:

8 front hot-swap 2.5" NVMe drive bay(s), 2 M.2 NVMe slot(s) (M-key)

RAM:

32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 5600MTs ECC DDR5

Network Ports:

2 SFP28 25GbE with Broadcom® BCM57414 (optional), 2 RJ45 10GbE with Intel® X710-AT2 (optional)

Key Features/Applications:

Artificial Intelligence (AI), HPC, AI / Deep Learning, Deep Learning/AI/Machine Learning Development

CPU:

Dual-Socket, AMD EPYC™ 9004 Series Processors

Chassis:

4U Rackmount Liquid Cooling

Drive:

Default: Total 8 bay(s) / 8 front hot-swap 2.5" NVMe drive bay(s)

RAM:

24 DIMM slots Up to 6TB: 4800 ECC DDR5

Network Ports:

1 RJ45 1 GbE Dedicated IPMI LAN port(s)

Key Features/Applications:

High Performance Computing, AI/Deep Learning Training, Large Language Model (LLM) Natural Language Processing

CPU:

Dual Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

Chassis:

4U Rackmount Liquid Cooling

Drive:

6 front hot-swap 2.5" NVMe/SATA drive bay(s)

RAM:

Slot Count: 32 DIMM slots Max Memory (2DPC): Up to 8TB 5600MT/s ECC DDR5

Network Ports:

2 RJ45 10GbE with Intel® X710-AT2

Key Features/Applications:

High Performance Computing, VDI, AI/Deep Learning Training, Media/Video Streaming, Cloud Gaming, Animation and Modeling, Design & Visualization, 3D Rendering, Diagnostic Imaging

CPU:

Dual Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

Chassis:

4U Rackmount Liquid Cooling

Drive:

8x HOT SWAP 2.5” SATA/SAS (AOC required), 8x 2.5" Hot-swap SATA drive bays, 8x2.5" Hot-swap NVMe drive bays

RAM:

Slot Count: 32 DIMM slots, Max Memory (1DPC): Up to 4TB 5600MT/s ECC RDIMM, Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM

Network Ports:

2 RJ45 10GbE with Intel® X710-AT2

Key Features/Applications:

AI / Deep Learning, High Performance Computing

CPU:

Dual Socket SP5 AMD EPYC™ 9004 Series Processors

Chassis:

4U Rackmount

Drive:

Default: Total 6 bay(s) 2 front hot-swap 2.5" SATA drive bay(s) 4 front hot-swap 2.5" NVMe drive bay(s)

RAM:

Slot Count: 24 DIMM slots Max Memory (1DPC): Up to 6TB 4800MT/s ECC DDR5 RDIMM/LRDIMM

Network Ports:

1 RJ45 1 GbE Dedicated IPMI LAN port(s) 2 RJ45 10 GBASE-T LAN port(s)

Key Features/Applications:

All-Flash NVMe Hyperconverged Infrastructure, Container-as-a-Service; Application Accelerator, High-Performance File System, Diskless HPC Clusters

CPU:

Dual Socket E (LGA 4677) support 5th/4th Gen Intel® Xeon® Scalable processors per node

Chassis:

2U Rackmount

Drive:

Default: Total 6 bay(s) 2 front hot-swap 2.5" PCIe 5.0 NVMe/SATA drive bay(s) 4 front hot-swap 2.5" PCIe 4.0 NVMe/SATA drive bay(s) per node

RAM:

16 DIMM Slots supporting up to 4TB of memory; ECC RDIMMs up to DDR5-5600 per node

Network Ports:

AIOM

Requesting Quote:

Please provide full specification including Processor, Memory, Storage, AIOM, AOC, TPM and any other requirements such as RAID

Key Features/Applications:

High-Performance File System, Diskless HPC Clusters, Scale Out All-Flash NVMe Storage, Big Data Analytics and AI

CPU:

Socket E (LGA 4677) support 5th/4th Gen Intel® Xeon® Scalable processors per node

Chassis:

2U Rackmount

Drive:

Default: Total 12 bay(s) 2 front hot-swap 2.5" PCIe 5.0 NVMe/SATA drive bay(s) 10 front hot-swap 2.5" PCIe 4.0 NVMe/SATA drive bay(s) per node

RAM:

16 DIMM Slots supporting up to 4TB of memory; ECC RDIMMs up to DDR5-5600 per node

Network Ports:

1 RJ45 1 GbE Dedicated BMC LAN port(s) per node