LIQUID COOLING SERVERS

Key Features/Applications:

High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Healthcare, Conversational AIBusiness Intelligence & AnalyticsDrug Discovery, Climate and Weather Modeling, Finance & Economics

CPU:

Dual 5th/4th Gen Intel® Xeon® Scalable processor support

Chassis:

2U Rackmount Liquid Cooling

Drive:

2 M.2 NVMe for boot drive only, 4x 2.5" Hot-swap NVMe/SATA3 drive bays

RAM:

32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 5600MTs ECC DDR5

Network Ports:

Flexible networking options

Key Features/Applications:

High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Healthcare, Conversational AIBusiness Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics

CPU:

5th/4th Gen Intel® Xeon® Scalable processor support

Chassis:

4U Rackmount Liquid Cooling

Drive:

8 front hot-swap 2.5" NVMe drive bay(s), 2 M.2 NVMe slot(s) (M-key)

RAM:

32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 5600MTs ECC DDR5

Network Ports:

2 SFP28 25GbE with Broadcom® BCM57414 (optional), 2 RJ45 10GbE with Intel® X710-AT2 (optional)

Key Features/Applications:

High Performance Computing, AI/Deep Learning Training, Large Language Model (LLM) Natural Language Processing

CPU:

Dual Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

Chassis:

4U Rackmount Liquid Cooling

Drive:

6 front hot-swap 2.5" NVMe/SATA drive bay(s)

RAM:

Slot Count: 32 DIMM slots Max Memory (2DPC): Up to 8TB 5600MT/s ECC DDR5

Network Ports:

2 RJ45 10GbE with Intel® X710-AT2

Key Features/Applications:

High Performance Computing, VDI, AI/Deep Learning Training, Media/Video Streaming, Cloud Gaming, Animation and Modeling, Design & Visualization, 3D Rendering, Diagnostic Imaging

CPU:

Dual Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

Chassis:

4U Rackmount Liquid Cooling

Drive:

8x HOT SWAP 2.5” SATA/SAS (AOC required), 8x 2.5" Hot-swap SATA drive bays, 8x2.5" Hot-swap NVMe drive bays

RAM:

Slot Count: 32 DIMM slots, Max Memory (1DPC): Up to 4TB 5600MT/s ECC RDIMM, Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM

Network Ports:

2 RJ45 10GbE with Intel® X710-AT2

Key Features/Applications:

All-Flash NVMe Hyperconverged Infrastructure, Container-as-a-Service; Application Accelerator, High-Performance File System, Diskless HPC Clusters

CPU:

Dual Socket E (LGA 4677) support 5th/4th Gen Intel® Xeon® Scalable processors per node

Chassis:

2U Rackmount

Drive:

Default: Total 6 bay(s) 2 front hot-swap 2.5" PCIe 5.0 NVMe/SATA drive bay(s) 4 front hot-swap 2.5" PCIe 4.0 NVMe/SATA drive bay(s) per node

RAM:

16 DIMM Slots supporting up to 4TB of memory; ECC RDIMMs up to DDR5-5600 per node

Network Ports:

AIOM

Requesting Quote:

Please provide full specification including Processor, Memory, Storage, AIOM, AOC, TPM and any other requirements such as RAID

Key Features/Applications:

High-Performance File System, Diskless HPC Clusters, Scale Out All-Flash NVMe Storage, Big Data Analytics and AI

CPU:

Socket E (LGA 4677) support 5th/4th Gen Intel® Xeon® Scalable processors per node

Chassis:

2U Rackmount

Drive:

Default: Total 12 bay(s) 2 front hot-swap 2.5" PCIe 5.0 NVMe/SATA drive bay(s) 10 front hot-swap 2.5" PCIe 4.0 NVMe/SATA drive bay(s) per node

RAM:

16 DIMM Slots supporting up to 4TB of memory; ECC RDIMMs up to DDR5-5600 per node

Network Ports:

1 RJ45 1 GbE Dedicated BMC LAN port(s) per node

Key Features/Applications:

Hyperscale / Hyperconverged, HPC and Big Data, Data Center Enterprise Applications, Telco Data Center

CPU:

Single Socket E (LGA-4677) Supports 4th/5th Gen Intel® Xeon® Scalable Processor per node

Chassis:

4U

Drive:

Default: Total 6 front hot-swap 2.5" NVMe*/SAS*/SATA drive bay(s) per node

RAM:

Slot Count: 16 DIMM slots Max Memory (2DPC): Up to 4TB 5600MT/s ECC DDR5 per node

Network Ports:

1 RJ45 1GbE per node

Key Features/Applications:

Hyperscale / Hyperconverged, HPC and Big Data, Data Center Enterprise Applications, Telco Data Center

CPU:

Single Socket E (LGA-4677) Supports 4th/5th Gen Intel® Xeon® Scalable Processor

Chassis:

4U

Drive:

Default: Total 8 2 rear hot-swap 3.5" NVMe/SAS/SATA drive bay(s) 6 front hot-swap 3.5" NVMe*/SAS*/SATA drive bay(s) per node

RAM:

Slot Count: 16 DIMM slots Max Memory (2DPC): Up to 4TB 5600MT/s ECC DDR5 per node

Network Ports:

1 RJ45 1GbE per node

Key Features/Applications:

Enterprise data center, EDA, Cloud, High-performance Computing (HPC), Liquid cooling solution is available

CPU:

Dual socket E (LGA-4677) supports 5th/4th Gen Intel® Xeon® Scalable processors

Chassis:

1U / 1 Node

Drive:

2 Hot-swap U.2 NVMe/SATA3 drive bays, 1 Hot-swap SATA3 drive bay, 1 M.2 2280, Optional: 4 M.2 NVMe via mezz card

RAM:

16 DDR5 DIMM slots 1DPC with 5600MHz ECC RDIMM

Network Ports:

Onboard Dual 25G Ethernet, 1 Mezzanine expansion slot and 3 different optional Mezzanine card., 1 OCP 3.0 network card (option), Optional: Dual 25G Ethernet / 100G EDR / 200G HDR / 400G NDR

Key Features/Applications:

Virtualization, Software-defined Storage, AI Inference and Machine Learning, Cloud Computing, Enterprise Server

CPU:

Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors

Chassis:

2U Rackmount

Drive:

8x 2.5" hot-swap NVMe/SATA/SAS drive bays; Optional 8x 2.5" hot-swap NVMe/SAS/SATA drive bays; 2x internal M.2 NVMe/SATA drive slots; Optional RAID support via storage add-on card

RAM:

Slot Count: 32 DIMM slots Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM / Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM

Network Ports:

Flexible networking options with up to 2 AIOM networking slots (OCP NIC 3.0 compatible)