LIQUID COOLING SERVERS

Key Features/Applications:

All-Flash NVMe Hyperconverged Infrastructure, Container-as-a-Service; Application Accelerator, High-Performance File System, Diskless HPC Clusters

CPU:

Dual Socket E (LGA 4677) support 5th/4th Gen Intel® Xeon® Scalable processors per node

Chassis:

2U Rackmount

Drive:

Default: Total 6 bay(s) 2 front hot-swap 2.5" PCIe 5.0 NVMe/SATA drive bay(s) 4 front hot-swap 2.5" PCIe 4.0 NVMe/SATA drive bay(s) per node

RAM:

16 DIMM Slots supporting up to 4TB of memory; ECC RDIMMs up to DDR5-5600 per node

Network Ports:

AIOM

Requesting Quote:

Please provide full specification including Processor, Memory, Storage, AIOM, AOC, TPM and any other requirements such as RAID

Key Features/Applications:

High-Performance File System, Diskless HPC Clusters, Scale Out All-Flash NVMe Storage, Big Data Analytics and AI

CPU:

Socket E (LGA 4677) support 5th/4th Gen Intel® Xeon® Scalable processors per node

Chassis:

2U Rackmount

Drive:

Default: Total 12 bay(s) 2 front hot-swap 2.5" PCIe 5.0 NVMe/SATA drive bay(s) 10 front hot-swap 2.5" PCIe 4.0 NVMe/SATA drive bay(s) per node

RAM:

16 DIMM Slots supporting up to 4TB of memory; ECC RDIMMs up to DDR5-5600 per node

Network Ports:

1 RJ45 1 GbE Dedicated BMC LAN port(s) per node

Key Features/Applications:

Enterprise data center, EDA, Cloud, High-performance Computing (HPC), Liquid cooling solution is available

CPU:

Dual socket E (LGA-4677) supports 5th/4th Gen Intel® Xeon® Scalable processors

Chassis:

1U / 1 Node

Drive:

2 Hot-swap U.2 NVMe/SATA3 drive bays, 1 Hot-swap SATA3 drive bay, 1 M.2 2280, Optional: 4 M.2 NVMe via mezz card

RAM:

16 DDR5 DIMM slots 1DPC with 5600MHz ECC RDIMM

Network Ports:

Onboard Dual 25G Ethernet, 1 Mezzanine expansion slot and 3 different optional Mezzanine card., 1 OCP 3.0 network card (option), Optional: Dual 25G Ethernet / 100G EDR / 200G HDR / 400G NDR

Key Features/Applications:

Enterprise Applications, High Performance Computing, Engineering/scientific research, Cloud, virtualization, financial, EDA

CPU:

Single Socket E2 (LGA-4710), Intel® Xeon® 6 processors

Chassis:

1U / 1 Node

Drive:

2 front-end hot-swap 2.5" NVMe/SAS drive bay(s); HW RAID 0 & 1 with Broadcom 3108, 1 M.2 2280/22110 NVMe/SATA3 drive (onboard)

RAM:

16 DIMM slots (2DPC) Max Memory: Up to 4TB 6400MT/s ECC DDR5 RDIMM

Network Ports:

Onboard Dual 25G Ethernet, 1 expansion slot w/ optional mezzanine cards

Key Features/Applications:

Enterprise data center, EDA, Cloud, High-performance Computing (HPC)

CPU:

Dual Socket E2 (LGA-4710), Intel® Xeon® 6 processors

Chassis:

1U / 1 Node

Drive:

4 E1.S drives, 1 NVMe M.2 2280 (onboard) Optional: 4 M.2 NVMe via mezz card

RAM:

16 DDR5 DIMM slots 1DPC with DDR5-6400MT/s ECC RDIMM/RDIMM 3DS

Network Ports:

Onboard Dual 25G Ethernet, 1 expansion slot w/ optional mezzanine cards, 1 expansion slot for OCP 3.0 compliant card (IB NDR/NDR200)