LIQUID COOLING SERVERS

Key Features/Applications:

High Performance Computing, AI/Deep Learning Training and Inference, Large Language Model (LLM) and Generative AI

CPU:

NVIDIA 72-core NVIDIA Grace CPU on GH200 Grace Hopper™ Superchip

Chassis:

1U Rackmount Liquid Cooling

Drive:

4 front hot-swap E1.S NVMe drive bay(s)

RAM:

Slot Count: Onboard Memory, Max Memory: Up to 480GB ECC LPDDR5X, Additional GPU Memory: Up to 96GB ECC HBM3

Network Ports:

1 RJ45 1 GbE Dedicated IPMI LAN port(s)

Key Features/Applications:

High Performance Computing, AI/Deep Learning Training and Inference, Large Language Model (LLM) and Generative AI

CPU:

NVIDIA 72-core NVIDIA Grace CPU on GH200 Grace Hopper™ Superchip

Chassis:

1U Rackmount Liquid Cooling

Drive:

8 front hot-swap E1.S NVMe drive bay(s)

RAM:

Slot Count: Onboard Memory, Max Memory: Up to 480GB ECC LPDDR5X, Additional GPU Memory: Up to 96GB ECC HBM3

Network Ports:

1 RJ45 1 GbE Dedicated IPMI LAN port(s)

Key Features/Applications:

All-Flash NVMe Hyperconverged Infrastructure, Container-as-a-Service; Application Accelerator, High-Performance File System, Diskless HPC Clusters

CPU:

Dual Socket E (LGA 4677) support 5th/4th Gen Intel® Xeon® Scalable processors per node

Chassis:

2U Rackmount

Drive:

Default: Total 6 bay(s) 2 front hot-swap 2.5" PCIe 5.0 NVMe/SATA drive bay(s) 4 front hot-swap 2.5" PCIe 4.0 NVMe/SATA drive bay(s) per node

RAM:

16 DIMM Slots supporting up to 4TB of memory; ECC RDIMMs up to DDR5-5600 per node

Network Ports:

AIOM

Requesting Quote:

Please provide full specification including Processor, Memory, Storage, AIOM, AOC, TPM and any other requirements such as RAID

Key Features/Applications:

Enterprise Applications, High Performance Computing, Engineering/scientific research, Cloud, virtualization, financial, EDA

CPU:

Single Socket E2 (LGA-4710), Intel® Xeon® 6 processors

Chassis:

1U / 1 Node

Drive:

2 front-end hot-swap 2.5" NVMe/SAS drive bay(s); HW RAID 0 & 1 with Broadcom 3108, 1 M.2 2280/22110 NVMe/SATA3 drive (onboard)

RAM:

16 DIMM slots (2DPC) Max Memory: Up to 4TB 6400MT/s ECC DDR5 RDIMM

Network Ports:

Onboard Dual 25G Ethernet, 1 expansion slot w/ optional mezzanine cards

Key Features/Applications:

Enterprise Applications, High Performance Computing, Engineering/scientific research, Cloud, virtualization, financial, EDA

CPU:

Dual Socket E2 (LGA-4710), Intel® Xeon® 6 processors

Chassis:

1U / 1 Node

Drive:

6 NVMe SSDs with 4 Hot-swap E3.S SSD (PCIe Gen5) and 2 M.2

RAM:

Supports 32x DDR5 ECC RDIMM/RDIMM 3DS (up to 6400MT/s 1DPC)

Network Ports:

Dual-port 25G Ethernet (LOM)

Coming Soon