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Key Features/Applications:
Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
CPU:
Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors
Chassis:
2U / 1 Node
Drive:
12x Hot-swap 3.5" SAS3/SATA3 drive bays including, 4x optional NVMe drives; 2x hot-swap 2.5" SATA3 drive bays (rear), 2x M.2 NVMe, Expander based backplane
RAM:
16x DDR4 DIMM Slots
Network Ports:
2x 10GBase-T LAN ports with Intel X722 + PHY Intel X557
Key Features/Applications:
Virtualization, Cloud Computing, High End Enterprise Server
CPU:
Dual AMD EPYC™ 7003/7002 Series Processors
Chassis:
1U
Drive:
12 Hot-swap 2.5" U.2 NVMe drive bays or SATA3/SAS3 (via optional SAS kit)
RAM:
32x DDR4 DIMM Slots
Network Ports:
Dual-port 10GBase-T and Dual-port 10G SFP+ via Intel X710-TM4
Key Features/Applications:
Enterprise Server, iSCSI SANHPC, Data Center, Database Processing & Storage, Corporate Database, Key Features
CPU:
Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
Chassis:
2U Rackmountable
Drive:
12x 3.5" hot-swap hybrid SATA/SAS drive bays (4 NVMe Hyprid Ports); 2 rear SATA 2.5" slots; onboard 1 M.2 NVMe
RAM:
16 ECC DDR4-3200: LRDIMM/RDIMM + 2 Intel® Optane™ Persistent Memory Dedicated Slots
Network Ports:
2x 10GbE BaseT with Intel® X550
Key Features/Applications:
High-Density Storage, Expansion up to 8 Petabytes, Optimized for High-Performance Datacenter
Chassis:
4U60 Bays JBOD storage chassis
Drive:
60x drives Dual IOM : 12 Gb SAS HDD and SSD drives Single IOM : 12 Gb SAS , or 6 Gb SATA HDD and SSD drives
Network Ports:
1 Gigabit Ethernet each IOM (management port) 1 RJ11 each IOM (management port)
Expansion:
Up to 8 sets of J5960 4U60 JBODs
Host Interface/ External IO Port:
6 Mini SAS HD connectors (SFF-8644) for upstream or downstream each IOM, 1 Gigabit Ethernet each IOM (management port), 1 RJ11 each IOM (management port)
Hot Swappable FRU:
HDD, IO Module, Power Supply Module, Fan
Power Supply:
80 PLUS Platinum 1200W Redundant Power Supply
Key Features/Applications:
Big Data & Analytics, Data Lake, HPC and AI/ML WorkloadsTelco & Cloud Service Providers, Financial Services & Healthcare Image Archives, Content Repositories, Government Data Protection
CPU:
Dual socket 3rd Gen Intel® Xeon® Scalable processors, up to 72 Cores
Chassis:
4U Rackmount
Drive:
60 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 2280 and 22110)
RAM:
16 ECC DDR4-3200: LRDIMM/RDIMM
Network Ports:
1 RJ45 1 GbE Dedicated IPMI LAN port(s), 2 RJ45 10 GBASE-T LAN port(s)
Key Features/Applications:
Virtualization, Cloud Computing, High End Enterprise Server
CPU:
Dual Socket E2 (LGA-4710) Intel® Xeon® 6 6700 series processors with E-cores
Chassis:
1U
Drive:
12 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bays (*NVMe/SAS/SATA support may require additional storage controller and/or cables)
RAM:
Slot Count: 32 DIMM slots Max Memory (2DPC): Up to 2TB 6400MT/s ECC DDR5 RDIMM
Network Ports:
1 RJ45 1 GbE Dedicated BMC LAN port(s)]
Coming Soon
Key Features/Applications:
High Density and Flexibility , Designed for the Enterprise and the Cloud
Drives:
60 x 3.5in drive bays
Drive Interface:
12Gb/s SAS, 6Gb/s SATA
Chassis:
4U
Daisy Chain:
Up to 4 units may be daisy-chained for a total raw capacity of 6.72PB
Host Interface:
Dual redundant I/O Modules (IOM), 6 Mini-SAS HD ports per IOM
Power:
Platinum: Dual 200-240V AC, 1600W, 1800W, Titanium: Dual 200-240V AC, 1600W
Cooling:
4 main enclosure fans, front-to-rear system cooling with zero-loss backflow prevention, 1 IO module fan, Dual PSUs with built-in fans