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Key Features/Applications:
Virtualization, Cloud Computing, High End Enterprise Server
CPU:
Dual AMD EPYC™ 7003/7002 Series Processors
Chassis:
1U
Drive:
12 Hot-swap 2.5" U.2 NVMe drive bays or SATA3/SAS3 (via optional SAS kit)
RAM:
32x DDR4 DIMM Slots
Network Ports:
Dual-port 10GBase-T and Dual-port 10G SFP+ via Intel X710-TM4
Key Features/Applications:
Enterprise Server, iSCSI SANHPC, Data Center, Database Processing & Storage, Corporate Database, Key Features
CPU:
Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
Chassis:
2U Rackmountable
Drive:
12x 3.5" hot-swap hybrid SATA/SAS drive bays (4 NVMe Hyprid Ports); 2 rear SATA 2.5" slots; onboard 1 M.2 NVMe
RAM:
16 ECC DDR4-3200: LRDIMM/RDIMM + 2 Intel® Optane™ Persistent Memory Dedicated Slots
Network Ports:
2x 10GbE BaseT with Intel® X550
Key Features/Applications:
Software-defined Storage, In-Memory Computing, Data Intensive HPC, Private & Hybrid Cloud, NVMe Over Fabrics Solution
CPU:
Single Socket SP5 AMD EPYC™ 9004 Series processors. Up to 300W TDP.
Chassis:
1U Rackmount
Drive:
16x hot-swap E3.S (7.5mm) NVMe drive bays
RAM:
Supports 24 DIMMs with 2DPC, up to 6TB memory capacity with 24 DIMMs of 256GB 3DS RDIMM/RDIMM DDR5 ECC memory
Network Ports:
AIOM
Key Features/Applications:
Enterprise Server, iSCSI SANHPC, Data Center, Database Processing & Storage, Corporate Database, Appliance Optimized Storage Building Blocks
CPU:
Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors
Chassis:
4U Rackmount
Drive:
24x 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Rear 2.5" SATA Slots, 2x NVMe M.2 (form factor: 2280 and 22110)
RAM:
Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s(1DPC) in 16 DIMM slots
Network Ports:
2x 10 GbE onboard via Broadcom BCM57416, 1x GbE Dedicated LAN for server remote management: IPMI 2.0 / KVM over LAN / Media over LAN
Key Features/Applications:
Enterprise Server, iSCSI SANHPC, Data Center, Database Processing & Storage, Corporate Database, Appliance Optimized Storage Building Blocks
CPU:
Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors
Chassis:
4U Rackmount
Drive:
36x 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Rear 2.5" SATA Slots, 2x NVMe M.2 (form factor: 2280 and 22110)
RAM:
Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s(1DPC) in 16 DIMM slots
Network Ports:
2x 10 GbE onboard via Broadcom BCM57416, 1x GbE Dedicated LAN for server remote management: IPMI 2.0 / KVM over LAN / Media over LAN
Key Features/Applications:
Enterprise Server, iSCSI SANHPC, Data Center, Database Processing & Storage, Corporate Database, Appliance Optimized Storage Building Blocks
CPU:
Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors
Chassis:
3U Rackmount
Drive:
16x 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Rear 2.5" SATA Slots, 2x NVMe M.2 (form factor: 2280 and 22110)
RAM:
Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s(1DPC) in 16 DIMM slots
Network Ports:
2x 10 GbE onboard via Broadcom BCM57416, 1x GbE Dedicated LAN for server remote management: IPMI 2.0 / KVM over LAN / Media over LAN
Key Features/Applications:
Designed for financial companies, AMD Xilinx Solarflare X2 and X3 Ethernet adapters validated
CPU:
AMD EPYC™ 4004 Series LGA1718 up to 170W TDP Processors
Chassis:
2U Rackmount
Drive:
8 front hot-swap 3.5" SAS/SATA drive bay(s)
RAM:
4 DDR5-5200 UDIMM ECC/Non-ECC slots supporting up to 192GB memory
Network Ports:
IPMI 2.0 + KVM with Dedicated LAN (1GbE), Dual 1GbE LAN (Intel® I210-AT)
Starting from: £1,324.00
Key Features/Applications:
Virtualization, Software-defined Storage, High Performance Computing, Cloud Computing, Enterprise Server
CPU:
Dual Intel® Xeon® 6 6700 series processors with E-cores
Chassis:
1U
Drive:
8x 2.5" hot-swap NVMe/SATA/SAS drive bays; Optional 4x 2.5" hot-swap NVMe/SAS/SATA drive bays; 2x internal M.2 NVMe drive slots; Optional RAID support via storage add-on card
RAM:
Slot Count: 32 DIMM slots Max Memory (1DPC): Up to 4TB 6400MT/s ECC DDR5 RDIMM Max Memory (2DPC): Up to 4TB 5200MT/s ECC DDR5 RDIMM
Network Ports:
1 RJ45 1 GbE Dedicated BMC LAN port(s)
Key Features/Applications:
Software-defined Storage, In-Memory Computing, Scale Out All-Flash NVMe Storage, Data Intensive HPC, Private & Hybrid Cloud, NVMe Over Fabrics Solution, Enhanced Graphics & AI, Generative AI
CPU:
Dual Socket E2 (LGA-4710) Intel® Xeon® 6 6700 series processors with E-cores
Chassis:
1U Rackmount
Drive:
16 front hot-swap E3.S 1T NVMe drive bays
RAM:
32 DIMM slots/2 Channels: Max Memory (1DPC): Up to 4TB 6400MT/s ECC DDR5 RDIMM/LRDIMM or Max Memory (2DPC): Up to 8TB 5200MT/s ECC DDR5 RDIMM/LRDIMM
Network Ports:
1 RJ45 1 GbE Dedicated BMC LAN port(s)
Coming Soon
Key Features/Applications:
Software-defined Storage, In-Memory Computing, Scale Out All-Flash NVMe Storage, Data Intensive HPC, Private & Hybrid Cloud, NVMe Over Fabrics Solution, AI/Deep Learning Training and Inference
CPU:
Dual Socket E2 (LGA-4710) Intel® Xeon® 6 6700 series processors with E-cores
Chassis:
2U Rackmount
Drive:
Default: 24 front hot-swap E3.S 1T PCIe 5.0 x4 NVMe drive bays. Option A: Total 32 bays 32 front hot-swap E3.S 1T PCIe 5.0 x4 NVMe drive bays. Option B: Total 24 bays 16 front hot-swap E3.S 1T PCIe 5.0 x4 NVMe drive bays, 8 front fixed E3.S 2T PCIe 5.0 x8 CXL Type 3 drive bays. Option C: Total 16 bays, 8 front hot-swap E3.S 1T PCIe 5.0 x4 NVMe drive bays, 8 front fixed E3.S 2T PCIe 5.0 x8 CXL Type 3 drive bays
RAM:
16+16 DIMM slots (2DPC), supports DDR4 RDIMM, LRDIMM, RDIMM/LRDIMM-3DS, Intel® Optane™ Persistent Memory 200 series
Network Ports:
1 OCP NIC 3.0 (PCIe4.0 x16) [CPU1]
Coming Soon