CLOUD SOLUTIONS

Key Features/Applications:

Web Server, Firewall Apps., Corporate-Wins, DNS, Print, Login, Gateway, provisioning servers, Compact Network Appliance, Cloud Computing

CPU:

Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)

Chassis:

1U / 1 Node

Drive:

4x Hot-swap 3.5" SAS3/SATA3 drive bays with SES2

RAM:

12x DDR4 DIMM Slots

Network Ports:

2x 1GbE LAN ports via Intel C621

Key Features/Applications:

Software-defined Storage, In-Memory Computing, Scale Out All-Flash NVMe Storage, Data Intensive HPC, Private & Hybrid Cloud, NVMe Over Fabrics Solution, AI/Deep Learning Training and Inference

CPU:

Dual Socket E2 (LGA-4710) Intel® Xeon® 6 6700 series processors with E-cores

Chassis:

2U Rackmount

Drive:

Default: 24 front hot-swap E3.S 1T PCIe 5.0 x4 NVMe drive bays. Option A: Total 32 bays 32 front hot-swap E3.S 1T PCIe 5.0 x4 NVMe drive bays. Option B: Total 24 bays 16 front hot-swap E3.S 1T PCIe 5.0 x4 NVMe drive bays, 8 front fixed E3.S 2T PCIe 5.0 x8 CXL Type 3 drive bays. Option C: Total 16 bays, 8 front hot-swap E3.S 1T PCIe 5.0 x4 NVMe drive bays, 8 front fixed E3.S 2T PCIe 5.0 x8 CXL Type 3 drive bays

RAM:

16+16 DIMM slots (2DPC), supports DDR4 RDIMM, LRDIMM, RDIMM/LRDIMM-3DS, Intel® Optane™ Persistent Memory 200 series

Network Ports:

1 OCP NIC 3.0 (PCIe4.0 x16) [CPU1]

Coming Soon

Key Features/Applications:

Enterprise Applications, High Performance Computing, Engineering/scientific research, Cloud, virtualization, financial, EDA

CPU:

Single Socket E2 (LGA-4710), Intel® Xeon® 6 processors

Chassis:

1U / 1 Node

Drive:

2 front-end hot-swap 2.5" NVMe/SAS drive bay(s); HW RAID 0 & 1 with Broadcom 3108, 1 M.2 2280/22110 NVMe/SATA3 drive (onboard)

RAM:

16 DIMM slots (2DPC) Max Memory: Up to 4TB 6400MT/s ECC DDR5 RDIMM

Network Ports:

Onboard Dual 25G Ethernet, 1 expansion slot w/ optional mezzanine cards

Key Features/Applications:

Enterprise data center, EDA, Cloud, High-performance Computing (HPC)

CPU:

Dual Socket E2 (LGA-4710), Intel® Xeon® 6 processors

Chassis:

1U / 1 Node

Drive:

4 E1.S drives, 1 NVMe M.2 2280 (onboard) Optional: 4 M.2 NVMe via mezz card

RAM:

16 DDR5 DIMM slots 1DPC with DDR5-6400MT/s ECC RDIMM/RDIMM 3DS

Network Ports:

Onboard Dual 25G Ethernet, 1 expansion slot w/ optional mezzanine cards, 1 expansion slot for OCP 3.0 compliant card (IB NDR/NDR200)

Key Features/Applications:

Enterprise data center, EDA, Cloud, High-performance Computing (HPC)

CPU:

Dual Socket E2 (LGA-4710), Intel® Xeon® 6 processors

Chassis:

1U / 1 Node

Drive:

4 E1.S drives, 1 M.2 2280 Optional: 4 M.2 NVMe via mezz card

RAM:

16 DDR5 DIMM slots 1DPC with DDR5-6400MT/s ECC RDIMM

Network Ports:

Onboard Dual 25G Ethernet 1 Mezzanine expansion slot and 3 different optional Mezzanine card. 1 OCP 3.0 network card (option) Optional: Dual 25G Ethernet / 100G EDR / 200G HDR / 400G NDR

Key Features/Applications:

Enterprise Applications, High Performance Computing, Engineering/scientific research, Cloud, virtualization, financial, EDA

CPU:

Single Socket E2 (LGA-4710), Intel® Xeon® 6 processors

Chassis:

1U / 1 Node

Drive:

4 Hot-swap E3.S SSD (PCIe Gen5)

RAM:

Supports 16x DDR5 ECC RDIMM/RDIMM 3DS (up to 6400MT/s 1DPC)

Network Ports:

Dual-port 25G Ethernet (LOM)

Key Features/Applications:

Enterprise Applications, High Performance Computing, Engineering/scientific research, Cloud, virtualization, financial, EDA

CPU:

Single Socket E2 (LGA-4710), Intel® Xeon® 6 processors, up to 350W TDP

Chassis:

1U / 1 Node

Drive:

Support up to 4 E3.S drives per blade

RAM:

Supports 16x DDR5 ECC RDIMM/RDIMM 3DS (up to 6400MT/s 1DPC)

Network Ports:

Dual-port 25G Ethernet (LOM), additional dual-port 25G Ethernet via mezzanine card

Key Features/Applications:

Enterprise Applications, High Performance Computing, Engineering/scientific research, Cloud, virtualization, financial, EDA

CPU:

Dual Socket E2 (LGA-4710), Intel® Xeon® 6 processors

Chassis:

1U / 1 Node

Drive:

6 NVMe SSDs with 4 Hot-swap E3.S SSD (PCIe Gen5) and 2 M.2

RAM:

Supports 32x DDR5 ECC RDIMM/RDIMM 3DS (up to 6400MT/s 1DPC)

Network Ports:

Dual-port 25G Ethernet (LOM)

Coming Soon

Key Features/Applications:

Enterprise Applications, High Performance Computing, Engineering/scientific research, Cloud, virtualization, financial, EDA

CPU:

Dual Socket E2 (LGA-4710), Intel® Xeon® 6 processors

Chassis:

1U / 1 Node

Drive:

10 NVMe SSDs with 8 Hot-swap E3.S PCIe Gen5 and 2 M.2

RAM:

Supports 32x DDR5 ECC RDIMM/RDIMM 3DS (up to 6400MT/s 1DPC)

Network Ports:

8 Hot-swap E3.S drive bays M.2: Optional: 2 M.2 2280 NVMe SSDs via adapter]

Coming Soon

Key Features/Applications:

Enterprise Applications, High Performance Computing, Engineering/scientific research, Cloud, virtualization, financial, EDA

CPU:

Dual Socket E2 (LGA-4710), Intel® Xeon® 6 processors

Chassis:

1U / 1 Node

Drive:

10 NVMe SSDs with 8 Hot-swap E3.S PCIe Gen5 and 2 M.2

RAM:

Supports 32x DDR5 ECC RDIMM/RDIMM 3DS (up to 6400MT/s 1DPC)

Coming Soon