GPU SOLUTIONS

Key Features/Applications:

2D/3D and CAD Applications, Big Data Analytics, Edge Computing, VDI, Cloud Computing, Virtualization

CPU:

Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors

Chassis:

2U / 1 Node

Drive:

8x Hot-swap 2.5" SAS/SATA drive bays, 2x Hot-swap 2.5" SATA/NVMe drive bays

RAM:

16x DDR4 DIMM Slots

Network Ports:

1x SIOM for flexible Networking

Key Features/Applications:

AI/ML, Deep Learning Training and Inference, Big Data Analytics, High Performance Computing (HPC, Research Laboratory/National Laboratory

CPU:

Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors

Chassis:

4U / 1 Node

Drive:

24x Hot-swap 3.5" drive bays

RAM:

24x DDR4 DIMM Slots

Network Ports:

2x 10GBase-T LAN ports

Key Features/Applications:

Network Security Appliance, SD-WAN, vCPE controller box, IoT Edge Computing

CPU:

Dual 2nd Gen Intel® Xeon® Scalable processors, up to 28 Cores, up to 56 Threads, 70-205W

Chassis:

4U Rackmountable / Tower Optional Rackmount Kit

Drive:

8 Hot-swap 3.5" drive bays

RAM:

16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM

Network Ports:

2x 10GBase-T LAN ports, Supports 10GBASE-T, 100BASE-TX, and 1000BASE-T; 1 dedicated LAN for IPMI 2.0

Key Features/Applications:

AI/ML, Deep Learning Training and Inference, High Performance Computing (HPC), Big Data Analytics, Astrophysics Simulation, Chemistry Simulation, Research Laboratory/National Laboratory

CPU:

Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)

Chassis:

4U Rackmountable

Drive:

Up to 24 Hot-swap 2.5" drive bays; 8x 2.5" SATA drives supported with included H/W, 2x 2.5" NVMe drives supported with included H/W, 1 NVMe based M.2 SSD

RAM:

24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM

Network Ports:

2x 10GBase-T LAN ports via Intel C622

Key Features/Applications:

AI/ML, Deep Learning Training and Inference, High Performance Computing (HPC), Big Data Analytics, Astrophysics Simulation, Chemistry Simulation, Research Laboratory/National Laboratory

CPU:

Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)

Chassis:

4U Rackmountable

Drive:

Up to 24 Hot-swap 2.5" drive bays 8x 2.5" SATA drives supported with included H/W, 2x 2.5" NVMe drives supported with included H/W

RAM:

24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM

Network Ports:

2x 10GBase-T LAN ports via Intel C622

Key Features/Applications:

High Performance Computing, AI/Deep Learning TrainingIndustrial Automation, Retail, Climate and Weather Modeling

CPU:

Dual Socket SP5, AMD EPYC™ 9004 Series Processors

Chassis:

8U Rackmount

Drive:

1 M.2 NVMe for boot drive only, 2x 2.5" Hot-swap SATA drive bays, up to 16x 2.5" Hot-swap NVMe drive bays (12 by default + 4 optional)

RAM:

Slot Count: 24 DIMM slots, Max Memory (2DPC): Up to 6TB 4800MT/s ECC DDR5 RDIMM/LRDIMM

Network Ports:

Flexible Networking

Key Features/Applications:

High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, HealthcareConversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics

CPU:

Dual 5th/4th Gen Intel® Xeon® Scalable processor support

Chassis:

8U Rackmount

Drive:

2 M.2 NVMe for boot drive only, 16x 2.5" Hot-swap NVMe drive bays (12x by default, 4x optional), 3x 2.5" Hot-swap SATA drive bays, Optional: 8x 2.5" Hot-swap SATA drive bays

RAM:

32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 5600MTs ECC DDR5

Network Ports:

Flexible networking options

Key Features/Applications:

High Performance Computing, AI/Deep Learning Training and Inference, Large Language Model (LLM) and Generative AI

CPU:

NVIDIA 72-core NVIDIA Grace CPU on GH200 Grace Hopper™ Superchip

Chassis:

1U Rackmount Liquid Cooling

Drive:

4 front hot-swap E1.S NVMe drive bay(s)

RAM:

Slot Count: Onboard Memory, Max Memory: Up to 480GB ECC LPDDR5X, Additional GPU Memory: Up to 96GB ECC HBM3

Network Ports:

1 RJ45 1 GbE Dedicated IPMI LAN port(s)

Key Features/Applications:

High Performance Computing, AI/Deep Learning Training and Inference, Large Language Model (LLM) and Generative AI

CPU:

NVIDIA 72-core NVIDIA Grace CPU on GH200 Grace Hopper™ Superchip

Chassis:

1U Rackmount Liquid Cooling

Drive:

8 front hot-swap E1.S NVMe drive bay(s)

RAM:

Slot Count: Onboard Memory, Max Memory: Up to 480GB ECC LPDDR5X, Additional GPU Memory: Up to 96GB ECC HBM3

Network Ports:

1 RJ45 1 GbE Dedicated IPMI LAN port(s)

Key Features/Applications:

Artificial Intelligence (AI), Large Language Model (LLM), Cloud Solution Provider (CSP), High Performance Comptue (HPC), Research Lab

CPU:

Quad AMD Instinct™ MI300A processors

Chassis:

2U Rackmount Liquid Cooling

Drive:

Default 8 hot-swap 2.5" NVMe dirve bays or Optional 8 hot-swap 2.5" SAS3/SATA3 drive bays via storage add-on card, 2 Internal NVMe/SATA M.2 slots

RAM:

Slot Count: Onboard Memory, Max Memory: Up to 512GB ECC HBM3

Network Ports:

1 RJ45 1 GbE Dedicated IPMI LAN port(s)