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HPC Solutions
Supermicro HPC solutions offer unique configurations that are designed to deal with various demanding workloads such as compute intensive tasks, high throughput and parallel processing applications. Supermicro’s HPC product range is always kept up to date with the newest technology as part of their first-to-market strategy, meaning that customers can benefit from the latest technology as soon as it becomes available. HPC servers from Supermicro are designed to be implemented in high density configurations so as to reduce the space used up in data center and cost of ownership. Supermicro's first to market strategy means that Supermicro are the first to release the newest server platforms so that customers can benefit from the latest technologies. Supermicro is actively innovating in both design and deployment to optimize every solution for a variety of workloads.
Features Include:
Key Features/Applications:
Edge Computing, Micro Data Center, AI/ML, Deep Learning Training and Inference, Virtualization, Cloud Computing
CPU:
Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors
Chassis:
1U / 1 Node
Drive:
2x Hot-swap 2.5" SAS/SATA drive bays, 2x Internal 2.5" SATA drive bays
RAM:
12x DDR4 DIMM Slots
Network Ports:
2x 10GBase-T LAN ports via Intel X540
Key Features/Applications:
Edge Computing, Micro Data Center, AI/ML, Deep Learning Training and Inference, Virtualization, Cloud Computing
CPU:
Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake
Chassis:
1U Rackmountable
Drive:
2 Hot-swap 2.5" SAS/SATA drive bays, 2 Internal 2.5" drive bays, Optional NVMe U.2 drive option
RAM:
12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM
Network Ports:
2x 10GBase-T LAN ports via Intel X540
Key Features/Applications:
3D/2D and CAD Applications, Cloud Computing, Edge Computing, Oil and Gas Exploration, VDI, AI/ML, Deep Learning Training and Inference
CPU:
Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors/p>
Chassis:
2U / 1 Node
Drive:
2x Hot-swap 2.5" SAS/SATA drive bays, 2x Hot-swap 2.5" SATA/NVMe drive bays
RAM:
16x DDR4 DIMM Slots
Network Ports:
1x SIOM for flexible Networking
Key Features/Applications:
AI/ML, Deep Learning Training and Inference, Big Data Analytics, High Performance Computing (HPC), Research Laboratory/National Laboratory
CPU:
Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors
Chassis:
4U / 1 Node
Drive:
16x Hot-swap 2.5" SAS/SATA drives (Optional 8x NVMe drives supported), 2x NVMe based M.2 SSD
RAM:
24x DDR4 DIMM Slots
Network Ports:
Dual 10GBase-T LAN with Intel® X540
Key Features/Applications:
Mission-critical applications, High Availability Storage, Appliance Platform
CPU:
Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake
Chassis:
1U / 2 Node
Drive:
4x Hot-swap 2.5" SATA3 drive bays
RAM:
16x DDR4 DIMM Slots per node
Network Ports:
Flexible Networking support via SIOM; Dedicated IPMI 2.0 LAN
Key Features/Applications:
Compute Intensive Application, HPC, Data Center, Enterprise Server, Financial Analysis, Mission-critical applications
CPU (Per Node):
Dual 2nd Gen Intel® Xeon® Scalable processors
Chassis:
2U / 4 Nodes
Drives (Per Node):
3 Hot-swap 3.5" SATA3 HDD trays
RAM (Per Node):
16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM,
Network Ports (Per Node):
Flexible Networking support via SIOM; Dedicated IPMI 2.0 LAN
Key Features/Applications (Per Node):
Web Cache, Cloud Computing, Web Hosting, VM, Social Networking, Corporate-WINS, DNS, Print, Login
CPU:
Single Intel® Xeon® processor E-2100/E-2200, 8th Gen., Intel® Core™ i3 Processors
Chassis:
3U / 8 Nodes
Drive:
2x 3.5" SATA3 drives or 2x 2.5" SATA3 w/ optional kits
RAM:
4x DDR4 DIMM Slots
Network Ports:
2 GbE LAN ports via Intel i350
Key Features/Applications:
Compute Intensive Applications, Data Center, HPC and Enterprise Applications, Hyperscale, Hyperconverged, VM, Social Networking
CPU (Per Node):
Dual 2nd Gen Intel® Xeon® Scalable, Up to 28 Cores, Up to 56 Threads, 70-165W
Chassis (Per Node):
4U / 8 Nodes
Drives (Per Node):
2 or 4 Fixed 2.5" SATA3/NVMe drive bays, M.2 Interface: 2 SATA/PCI-E 3.0 x4, RAID 0 & 1/p>
RAM (Per Node):
12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM,
Network Ports (Per Node):
Dual GbE ports via SIOM Network card, 1 dedicated IPMI LAN port
Key Features/Applications:
Network Security Appliance, SD-WAN, vCPE controller box, IoT Edge Computing
CPU:
Dual 2nd Gen Intel® Xeon® Scalable processors, up to 28 Cores, up to 56 Threads, 70-205W
Chassis:
4U Rackmountable / Tower Optional Rackmount Kit
Drive:
8 Hot-swap 3.5" drive bays
RAM:
16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
Network Ports:
2x 10GBase-T LAN ports, Supports 10GBASE-T, 100BASE-TX, and 1000BASE-T; 1 dedicated LAN for IPMI 2.0
Key Features/Applications:
Edge Computing, Micro Data Center, AI/ML, Deep Learning Training and Inference, Virtualization, Cloud Computing
CPU:
Single Socket P (LGA 3647) supports 2nd Gen Intel® Xeon® Scalable processor
Chassis:
1U
Drive:
6 Hot-swap 2.5" SAS/SATA drive bays
RAM:
6 DIMMs; up to 1.5TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
Network Ports:
2x 10GBase-T LAN ports via Intel X550