LIQUID COOLING

Key Features/Applications:

Enterprise Applications, High Performance Computing, Engineering/scientific research, Cloud, virtualization, financial, EDA

CPU:

Single Socket E2 (LGA-4710), Intel® Xeon® 6 processors

Chassis:

1U / 1 Node

Drive:

2 front-end hot-swap 2.5" NVMe/SAS drive bay(s); HW RAID 0 & 1 with Broadcom 3108, 1 M.2 2280/22110 NVMe/SATA3 drive (onboard)

RAM:

16 DIMM slots (2DPC) Max Memory: Up to 4TB 6400MT/s ECC DDR5 RDIMM

Network Ports:

Onboard Dual 25G Ethernet, 1 expansion slot w/ optional mezzanine cards

Key Features/Applications:

Enterprise data center, EDA, Cloud, High-performance Computing (HPC)

CPU:

Dual Socket E2 (LGA-4710), Intel® Xeon® 6 processors

Chassis:

1U / 1 Node

Drive:

4 E1.S drives, 1 NVMe M.2 2280 (onboard) Optional: 4 M.2 NVMe via mezz card

RAM:

16 DDR5 DIMM slots 1DPC with DDR5-6400MT/s ECC RDIMM/RDIMM 3DS

Network Ports:

Onboard Dual 25G Ethernet, 1 expansion slot w/ optional mezzanine cards, 1 expansion slot for OCP 3.0 compliant card (IB NDR/NDR200)

Key Features/Applications:

Enterprise Applications, High Performance Computing, Engineering/scientific research, Cloud, virtualization, financial, EDA

CPU:

Dual Socket E2 (LGA-4710), Intel® Xeon® 6 processors

Chassis:

1U / 1 Node

Drive:

6 NVMe SSDs with 4 Hot-swap E3.S SSD (PCIe Gen5) and 2 M.2

RAM:

Supports 32x DDR5 ECC RDIMM/RDIMM 3DS (up to 6400MT/s 1DPC)

Network Ports:

Dual-port 25G Ethernet (LOM)

Coming Soon

Key Features/Applications:

Enterprise Applications, High Performance Computing, Engineering/scientific research, Cloud, virtualization, financial, EDA

CPU:

Dual Socket E2 (LGA-4710), Intel® Xeon® 6 processors

Chassis:

1U / 1 Node

Drive:

10 NVMe SSDs with 8 Hot-swap E3.S PCIe Gen5 and 2 M.2

RAM:

Supports 32x DDR5 ECC RDIMM/RDIMM 3DS (up to 6400MT/s 1DPC)

Network Ports:

8 Hot-swap E3.S drive bays M.2: Optional: 2 M.2 2280 NVMe SSDs via adapter]

Coming Soon

Key Features/Applications:

Enterprise Applications, High Performance Computing, Engineering/scientific research, Cloud, virtualization, financial, EDA

CPU:

Dual Socket E2 (LGA-4710), Intel® Xeon® 6 processors

Chassis:

1U / 1 Node

Drive:

10 NVMe SSDs with 8 Hot-swap E3.S PCIe Gen5 and 2 M.2

RAM:

Supports 32x DDR5 ECC RDIMM/RDIMM 3DS (up to 6400MT/s 1DPC)

Coming Soon