We use cookies to make your experience better. To comply with the new e-Privacy directive, we need to ask for your consent to set the cookies. Learn more.
Key Features/Applications:
High Performance Computing, AI/Deep Learning Training and Inference, Large Language Model (LLM) and Generative AI
CPU:
NVIDIA 72-core NVIDIA Grace CPU on GH200 Grace Hopper™ Superchip
Chassis:
1U Rackmount Liquid Cooling
Drive:
4 front hot-swap E1.S NVMe drive bay(s)
RAM:
Slot Count: Onboard Memory, Max Memory: Up to 480GB ECC LPDDR5X, Additional GPU Memory: Up to 96GB ECC HBM3
Network Ports:
1 RJ45 1 GbE Dedicated IPMI LAN port(s)
Key Features/Applications:
High Performance Computing, AI/Deep Learning Training and Inference, Large Language Model (LLM) and Generative AI
CPU:
NVIDIA 72-core NVIDIA Grace CPU on GH200 Grace Hopper™ Superchip
Chassis:
1U Rackmount Liquid Cooling
Drive:
8 front hot-swap E1.S NVMe drive bay(s)
RAM:
Slot Count: Onboard Memory, Max Memory: Up to 480GB ECC LPDDR5X, Additional GPU Memory: Up to 96GB ECC HBM3
Network Ports:
1 RJ45 1 GbE Dedicated IPMI LAN port(s)
Key Features/Applications:
Hyperscale / Hyperconverged, HPC and Big Data, Data Center Enterprise Applications, Telco Data Center
CPU:
Single Socket E (LGA-4677) Supports 4th/5th Gen Intel® Xeon® Scalable Processor per node
Chassis:
4U
Drive:
Default: Total 6 front hot-swap 2.5" NVMe*/SAS*/SATA drive bay(s) per node
RAM:
Slot Count: 16 DIMM slots Max Memory (2DPC): Up to 4TB 5600MT/s ECC DDR5 per node
Network Ports:
1 RJ45 1GbE per node
Key Features/Applications:
Enterprise Applications, High Performance Computing, Engineering/scientific research, Cloud, virtualization, financial, EDA
CPU:
Single Socket E2 (LGA-4710), Intel® Xeon® 6 processors
Chassis:
1U / 1 Node
Drive:
2 front-end hot-swap 2.5" NVMe/SAS drive bay(s); HW RAID 0 & 1 with Broadcom 3108, 1 M.2 2280/22110 NVMe/SATA3 drive (onboard)
RAM:
16 DIMM slots (2DPC) Max Memory: Up to 4TB 6400MT/s ECC DDR5 RDIMM
Network Ports:
Onboard Dual 25G Ethernet, 1 expansion slot w/ optional mezzanine cards