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Key Features/Applications:
High Performance Computing, AI/Deep Learning Training and Inference, Large Language Model (LLM) and Generative AI
CPU:
NVIDIA 72-core NVIDIA Grace CPU on GH200 Grace Hopper™ Superchip
Chassis:
1U Rackmount Liquid Cooling
Drive:
4 front hot-swap E1.S NVMe drive bay(s)
RAM:
Slot Count: Onboard Memory, Max Memory: Up to 480GB ECC LPDDR5X, Additional GPU Memory: Up to 96GB ECC HBM3
Network Ports:
1 RJ45 1 GbE Dedicated IPMI LAN port(s)
Key Features/Applications:
High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Healthcare, Conversational AIBusiness Intelligence & AnalyticsDrug Discovery, Climate and Weather Modeling, Finance & Economics
CPU:
Dual 5th/4th Gen Intel® Xeon® Scalable processor support
Chassis:
2U Rackmount Liquid Cooling
Drive:
2 M.2 NVMe for boot drive only, 4x 2.5" Hot-swap NVMe/SATA3 drive bays
RAM:
32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 5600MTs ECC DDR5
Network Ports:
Flexible networking options
Key Features/Applications:
High-Performance File System, Diskless HPC Clusters, Scale Out All-Flash NVMe Storage, Big Data Analytics and AI
CPU:
Socket E (LGA 4677) support 5th/4th Gen Intel® Xeon® Scalable processors per node
Chassis:
2U Rackmount
Drive:
Default: Total 12 bay(s) 2 front hot-swap 2.5" PCIe 5.0 NVMe/SATA drive bay(s) 10 front hot-swap 2.5" PCIe 4.0 NVMe/SATA drive bay(s) per node
RAM:
16 DIMM Slots supporting up to 4TB of memory; ECC RDIMMs up to DDR5-5600 per node
Network Ports:
1 RJ45 1 GbE Dedicated BMC LAN port(s) per node
Key Features/Applications:
Enterprise data center, EDA, Cloud, High-performance Computing (HPC)
CPU:
Dual Socket E2 (LGA-4710), Intel® Xeon® 6 processors
Chassis:
1U / 1 Node
Drive:
4 E1.S drives, 1 NVMe M.2 2280 (onboard) Optional: 4 M.2 NVMe via mezz card
RAM:
16 DDR5 DIMM slots 1DPC with DDR5-6400MT/s ECC RDIMM/RDIMM 3DS
Network Ports:
Onboard Dual 25G Ethernet, 1 expansion slot w/ optional mezzanine cards, 1 expansion slot for OCP 3.0 compliant card (IB NDR/NDR200)
Key Features/Applications:
Enterprise Applications, High Performance Computing, Engineering/scientific research, Cloud, virtualization, financial, EDA
CPU:
Dual Socket E2 (LGA-4710), Intel® Xeon® 6 processors
Chassis:
1U / 1 Node
Drive:
6 NVMe SSDs with 4 Hot-swap E3.S SSD (PCIe Gen5) and 2 M.2
RAM:
Supports 32x DDR5 ECC RDIMM/RDIMM 3DS (up to 6400MT/s 1DPC)
Network Ports:
Dual-port 25G Ethernet (LOM)
Coming Soon